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The effect of reflow time and reflow temperatures on wettability and bond shear strength of Sn–3.5Ag solder alloy on a Cu substrate is assessed for reflow times of 10 s, 100 s, 300 s, 500 s and reflow temperatures of 250 °C, 270 °C, 290 °C, 320 °C. The wetting regime was found to have capillary, gravity, and viscous regimes. A microstructural study using a scanning electron microscope (SEM) with energydispersive spectroscopy revealed the presence of intermetallic compounds at the interface between the substrate and solder droplet. The bond strength of the solder joint is maximum at a reflow temperature of 250  °C and a reflow time of 10 s. Bond shear strength decreased with an increase in reflow time from 10 s to 500 s. The effect of different cooling conditions on the solder–substrate joint is also investigated.

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions