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In situ spherical TiC p -reinforced copper matrix composites were prepared via hot-pressing sintering assisted with copper plating. Brinell hardness and electrical conductivity of composites with various contents were investigated, room temperature compression properties and fractography of optimal TiC p /Cu composites and sintered pure copper were analysed. It was found that with the increase of TiC p  content, Brinell hardness of composites was increased, while electrical conductivity decreased. When TiC p  content was 1.0 wt-%, the Brinell hardness increased significantly and the conductivity was maintained at a high level. Compared with sintered pure copper, the yield strength and ultimate compressive strength of the composites were improved, while the fracture strain was reduced.

Properties of TiC p /Cu composites fabricated by powder metallurgy and electrodeless copper plating