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The aim of this study was to evaluate the anti-MMP activity of two concentrations of copper nanoparticles ( CuNp ) and the effect of their addition to a universal adhesive system on resin cement-radicular dentin  in situ  degree of conversion (DC), elastic modulus (EM), nanoleakage (NL), and push-out bond strength (PBS). Anti-MMP activity was evaluated for several MMPs. Seventy-two roots of endodontically prepared human lower premolars were randomly divided into six groups according to  CuNp  concentration (0% [control], 0.1%, 0.2%) and adhesive strategy (etch-and-rinse [ER] and self-etch [SE]). Fiber posts were cemented, DC was measured using micro-Raman spectroscopy, the EM of the hybrid layer and adhesive layer was measured using a nano-indenter, the NL was evaluated by scanning electron microscopy, and PBS was tested at 0.5 mm/min. Data were analyzed by two-way ANOVA and Tukey’s test (α = 0.05).  CuNp  demonstrated anti-MMP activity ( p  &lt; 0.01).  CuNp  containing-adhesives showed significant increased DC ( p  = 0.01), increased EM in the hybrid layer and adhesive layer ( p  = 0.001), decreased NL values ( p  = 0.001), and increased PBS ( p  = 0.0001). Adhesive strategy was not statistically significant ( p  &gt; 0.47). Usually, a significant difference among root thirds was observed, except for DC and NL when  CuNp  0.2% was evaluated. This is the first  in vitro  study showing that the incorporation of  CuNp  in an adhesive is an achievable alternative that can provide anti-MMP activity and improve the mechanical and bonding properties to root canal dentin.

journal of adhesion science and technology

A universal adhesive containing copper nanoparticles improves the bonding and mechanical properties of resin cement–root dentin interface: an  in vitro  study