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In this study, modified sericite is used to improve the bonding performance of polyimide(PI) adhesives which owe to its high temperature resistance, corrosion resistance and low cost. In order to further improve the performance of PI adhesives, PI/sericite composites were prepared by polyamide acid salt method. XRD and SEM analysis show that, after modification, the interlayer spacing of sericite is greatly enlarged, and the lamellar structure of sericite is clearly visible and extremely loose; XRD, TGA and bonding strength found that, The addition of TEA do not change the excellent performance of polyimide, modified sericite lamellae was successfully inserted into the polyimide molecular chain, and the sericite crystal plane spacing expanded and dispersed in the polymer matrix in the form of exfoliation; When the organic sericite content is 3 wt%, the T 52 and T 103 of the modified PI materials are 25 and 21 °C higher than that of pure PI, the bonding strength is nearly 20 MPa, which is 29.67% higher than that of pure PI.

Structure and properties of polyimide/sericite composite adhesive prepared bypolyamide acid salt method