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The new research trend is thread cool electronic devices using heat pipes filled with nanofluid. The various investigation based on experimental work, mathematical modelling, statistical analysis, and numerical study has been considered for pure metal, metal oxide, carbide, nitride, and carbon nanofluids. This article is content with heat pipe types, various types of heat pipe materials, different types of nanofluid, particle size, percentage concentration, filling ratio, preparation methods, and Characterisation techniques. The statistical analysis was carried out based on year-wise research trends, publication on several types of nanofluid, types of methods used to prepare nanofluid, and Characterisation techniques used. The outcome reveals that oxide-based nanofluid with a two-step method and 1 wt% concentration stood superior. It also suggests that pulsating heat pipes with a 50–60% filling ratio have better performance for the thermal management of electronic components.

Current research trend in nanofluid-filled pulsating heat pipe technology for electronic component cooling