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The paper deals with the experimental and numerical investigation of IC chips supplied with different heat flux under laminar forced convection. Seven different configurations (λ) are selected for the study and the substrate board (SMPS board) is oriented for four different angles 0°, 30°, 60°, and 90°. The goal of the current work is to determine the optimum λ, position, and orientation of the substrate board to minimise the temperature of the IC chips. Numerical results are validated with the experimental results and the optimum configuration (λ) is 1.68806. There is a temperature drop of 3–5°C for 30° orientation of the board in comparison with the horizontal orientation of the board.

Experiment and numerical investigation on optimal distribution of discrete ICs for different orientation of substrate board