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The electroless plating method is the most convenient for the metallisation of dielectrics. During this statistical study of the process, complex relationships were found between the composition of the electrolyte and the deposition regime. The complexity of this technology is an important multifactorial object of the study. An adequate linear regression model for electroless deposition of Cu-Ni-P alloy coatings was obtained by conducting a planned factorial experiment. It allows predicting the thickness of the electroless deposited alloy coating based on certain values of the input parameters (concentrations of copper sulphate, nickel sulphate and sodium hypophosphite) in the studied factor space, as well as further optimisation of the process.

Study of a system for creating a statistical model of the electroless plating of Cu-Ni-P alloys