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A new ethylene glycol electrolyte for nickel-tin coatings electrodeposition based on Ni(II) and Sn(II) chlorides and citric acid has been developed. It ensures the formation of coatings with high (about 40 wt%) nickel content, which include Ni 3 Sn 2  and Ni 3 Sn 4  phases. The electrolyte is stable during operation and storage, and provides growth of coatings at a rate of 9–18 μm h –1  and current efficiency of 89–94%. Citric acid stabilises the electrolyte by inhibiting the oxidation of Sn(II) during storage; in addition, it increases current efficiency, slowing down the reduction of hydrogen. According to voltammetry data the joint reduction of Sn(II) and Ni(II) from citrate-glycol electrolyte occurs with the effect of depolarisation due to the formation of intermetallics.

Electrodeposition of Ni–Sn alloy from ethylene glycol electrolyte. Part 1. Cathodic reactions