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In superconducting quantum devices, air bridges enable increased circuitcomplexity and density as well as mitigate the risk of microwave loss arisingfrom mode mixing. We implement aluminum air bridges using a simple processbased on single-step electron-beam gradient exposure. The resulting bridgeshave sizes ranging from $20~\mu m$ to $100~\mu m$, with a yield exceeding$99~\%$ for lengths up to $36~\mu m$. When used to connect ground planes incoplanar waveguide resonators, the induced loss contributed to the system isnegligible, corresponding to a reduction of the quality factor exceeding$1.0\times10^8$ per bridge. The bridge process is compatible with Josephsonjunctions and allows for the simultaneous creation of low loss bandages betweensuperconducting layers.

Aluminum air bridges for superconducting quantum devices realized using a single step electron-beam lithography process