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Quantifying the temperature of microdevices is critical for probing nanoscaleenergy transport.Such quantification is often accomplished by integratingresistance thermometers into microdevices. However, such thermometersfrequently become structurally unstable and fail due to thermal stresses atelevated temperatures. Here, we show that custom-fabricated scanning thermalprobes (STPs) with a sharp tip and an integrated heater/thermometer canaccurately measure the temperature of microdevices held at elevatedtemperatures. This measurement is accomplished by introducing a modulated heatinput to the STP after contacting the microdevice with the STP's tip, andcharacterizing the DC and AC components of the STP's temperature.From thesemeasured temperature components, the tip-to-sample thermal resistance and themicrodevice surface temperature are deduced via a simple lumped-capacitancemodel. The advances presented here can greatly facilitate temperaturemeasurements of a variety of heated microdevices.

Quantifying the Temperature of Heated Microdevices Using Scanning Thermal Probes