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For a comprehensive characterization of mechanical reliability ofmetallization layers on polymer substrates both electrical and mechanicaldegradation should be taken into account. Although it is evident that crackingof a conductive film should lead to electrical degradation, the quantitativerelationship between the growth of electric resistance and parameters of theinduced crack pattern has remained thus far unexplored. With the help of finiteelement modelling we were able to find an explicit and concise expression whichshows that electrical resistance grows with the fourth order of the cracklength and second order of the areal crack density. The discovered relationshipwas verified by comparison with the experimental results of tensile testing ofpolymer-supported thin metal films. Presented model is independent of thelength scale and can be applied to films with different thicknesses as long asOhm's law is valid. It is demonstrated that linear crack density is anambiguous parameter which does not properly capture the development of a crackpattern. For the unambiguous characterization of the intensity of a crackpattern a universal dimensionless factor is proposed. Presented results showthat there is a wide range of possible crack patterns which do not lead toelectrical failure of a conductive film that can be used for failure-freedesign of flexible electronic devices.

Explicit relationship between electrical and topological degradation of polymer-supported metal films subjected to mechanical loading