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State-of-the-art microfabricated ion traps for quantum information researchare approaching nearly one hundred control electrodes. We report here on thedevelopment and testing of a new architecture for microfabricated ion traps,built around ball-grid array (BGA) connections, that is suitable forincreasingly complex trap designs. In the BGA trap, through-substrate viasbring electrical signals from the back side of the trap die to the surface trapstructure on the top side. Gold-ball bump bonds connect the back side of thetrap die to an interposer for signal routing from the carrier. Trenchcapacitors fabricated into the trap die replace area-intensive surface or edgecapacitors. Wirebonds in the BGA architecture are moved to the interposer.These last two features allow the trap die to be reduced to only the arearequired to produce trapping fields. The smaller trap dimensions allow tightfocusing of an addressing laser beam for fast single-qubit rotations.Performance of the BGA trap as characterized with $^{40}$Ca$^+$ ions iscomparable to previous surface-electrode traps in terms of ion heating rate,mode frequency stability, and storage lifetime. We demonstrate two-qubitentanglement operations with $^{171}$Yb$^+$ ions in a second BGA trap.

Ball-grid array architecture for microfabricated ion traps