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Epitaxial growth of Ni(Al)Si0.7Ge0.3 on relaxed Si0.7Ge0.3/Si(100) substrates was achieved via an Al interlayer mediated epitaxy. After annealing, most of the Al atoms from the original 3 nm interlayer diffused toward the surface but the remaining Al atoms in the epitaxial monogermanosilicide distributed uniformly, independent of the annealing temperatures. The incorporation of Al increases the transition temperature from the Ni-rich germanosilicide phase to the monogermanosilicide phase. The reduced Ni diffusion, the increased lattice constant due to substitutional Al, and the increased thermal expansion of monogermanosilicide are assumed to be the main mechanisms enabling the epitaxial growth of the quaternary silicide. (C) 2011 American Institute of Physics. [doi:10.1063/1.3601464

Epitaxial growth of Ni(Al)Si0.7Ge0.3 on Si0.7Ge0.3/Si(100) by Al interlayer mediated epitaxy