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5$\mu$m thick SmCo films were deposited onto Si substrates using triodesputtering. A study of the influence of deposition temperature (Tdep <= 600degrees C) on the structural, magnetic and mechanical properties has shown thatoptimum properties (highest degree of in-plane texture, maximum in-planecoercivity and remanence (1.3 and 0.8 T, respectively), no film peel-off) areachieved for films deposited at the relatively low temperature of 350 degreesC. This temperature is compatible with film integration intoMicro-Electro-Mechanical-Systems (MEMS). The deposition rate was increased from3.6 to 18 $\mu$m/h by increasing the surface area of the target from 7 to 81cm2. Mechanically stable films could be prepared by deposition ontopre-patterned films or deposition through holes in a mask.

Structural, magnetic and mechanical properties of 5 $\mu$m thick SmCo films for use in Micro-Electro-Mechanical-Systems