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A strong crystallographic orientation relationship between the Cu6Sn5 scallop-type grains and their Cu substrate has been found by synchrotron micro-x-ray diffraction study. Even though the crystal structures of Cu6Sn5 (monoclinic) and Cu (face-centered-cubic) are very different, angular distributions of crystallographic directions between Cu6Sn5 and Cu revealed a strong orientation relationship. Both SnPb solder and pure Sn showed the same result, indicating that this is general behavior between Sn-based solders and Cu. The strong orientation relation suggests that Cu6Sn5 forms prior to Cu3Sn in the wetting reactions. A total of six different orientation relationships were found. In all the cases, the [1¯01] direction of Cu6Sn5 preferred to be parallel to the [110] direction of Cu with a misfit of 0.24%. Due to pseudohexagonal structure of the Cu6Sn5, the six relationships can be categorized into two groups. From the orientation distribution, one group was found to be less rigid then the other group.

Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu