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Cleaving crystals in a vacuum chamber is a simple method for obtainingatomically flat and clean surfaces for materials that have a preferentialcleaving plane. Most in-situ cleavers use parallel cutting edges that areapplied from two sides on the sample. We found in ambient experiments thatdiagonal cutting pliers, where the cleavage force is introduced in a singlepoint instead of a line work very well also for hard materials. Here, weincorporate the diagonal cutting plier principle in a design compatible withultra-high vacuum requirements. We show optical microscopy (mm scale) andatomic force microscopy (atomic scale) images of NiO(001) surfaces cleaved withthis device.Comment: 7 pages, 3 figures Submitted to Review of Scientific Instruments  (2005

Device for in situ cleaving of hard crystals