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Contrary to most classical adhesion test, the blister test provides quantitative adhesion energy measurements. We demonstrate its application to 1 03BCm thick W films in tensile stress state deposited by xenon DC magnetron sputtering on PECVD/Si(100) substrates. The W films surface morphology, structure and residual stress were also characterized by atomic force microscopy, X-ray diffraction and substrate curvature measurements as function of the deposition pressure. Films characteristics are compared with those of W films deposited directly

Characterization of W Films on Si and SiO2/Si Substrates by X-Ray Diffraction, AFM and Blister Test Adhesion Measurements