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Chip On Film(COF) is the key component of electronic products, and is different from Printed Circuit Board(PCB). The properties of high flexibility, thin thickness, lightweight and high wiring density make it difficult to inspect COF, especially dust particles interference. Dust particles are similar to defects, and it is hard to identify dust particles from defects, so dust particles interference of quality test is the difficulty of automatic surface defect detection. In this paper, a new method to identify dust particles is discussed from abnormal area called junction points detection and machine learning method Support Vector Machine(SVM) according to the characteristics of dust particles. As a result, a 94.8% correct rate of dust particles images identification has been achieved with the method

Research on Identification of Dust Particles on COF