English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Automated optical inspection is an important test procedure in electronic circuits assembly. Frequently 3d information is required and laser light sectioning sensors are often applied. However, some effects complicate the reliable automatic detection of the shape of such assemblies and their components. The packages of electronic components often are made of black plastics or ceramics so that the intensity available for the optical detection is quite low, especially in comparison to the surface of the PCBs where the components are mounted on. In addition due to rough surfaces of the components and the coherence length of the laser light speckle structures arise. In the work presented here a piezo actuator is used to oscillate the illuminating laser lines along the direction of the lines. The aim is to reduce the visibility of the speckle structures by averaging while maintaining the geometrical shape of the lines. In addition, image processing methods like segmentation and skeletonization are used to allow the detection of the shape of components and assemblies also if materials with distinct differences in the reflectivity are involved. Investigations include the influence of the parameters amplitude and frequency of the piezo actuator

Speckle reduction for a laser light sectioning sensor