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Structural adhesive bonding is well-etablished in the spatial industry, especially on the Ariane 5 SYLDA. This one enables the launcher to carry a second satellite inside the fairing. In most cases, joints can be fabricated indoors under controlled conditions. However, SYLDA structure is exposed to thermal and mechanical loads due to its lifecycle (from the transport to the launching). The cold-curing adhesive used on SYLDA is the Hysol EA-9321. Until now, few studies have been carried on the influence of the curing degree on the mechanical behaviour of bonding joints. It is one of the objectives of this work. The curing kinetics of the adhesive will be investigated in order to study their impact on the mechanical behavior of the Hysol EA-9321 during SYLDA’s lifecycle.

Kinetics studies of the polymerization and analysis of the mechanical behavior of the adhesive hysol EA-9321