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The solid state diffusion bonding leads to helium-tight ceramic-metal junctions. However this technique induces residual stresses due to expansion mismatches which may cause ceramic flaws to propagate hence junction delayed failure. This phenomenon is evidenced on glass-ceramic/Al/Invar junctions from which a better reliability is ensured by a reduction of surface flaws

RELIABILITY OF METAL/GLASS-CERAMIC JUNCTIONS MADE BY SOLID STATE BONDING