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Using microfluidic technology to achieve integrated chip cooling is becoming a promising method to extend Moore law effective period. The thermal management is always critical for 3D integrated circuit design. Hot spots due to spatially non-uniform heat flux in integrated circuits can cause physical stress that further reduces reliability. The critical point for chip cooling is to use microfluidic cooling accurately on the hot spots. First, based on electro-wetting on dielectric, the paper presents an adaptive chip cooling technique using the digital microfluidics. Then, a two-plans 3D chip cooling model has been given with its working principle and characteristics. And single plan chip cooling model is presented, including its capacitance performance and models. Moreover, the dentate electrode is designed to achieve droplet continuing movement. Next, the ant colony optimization is adopted to get optimal route during electrode moving. Last, the experiments demonstrate the adaptive chip cooling technique proposed in this paper is effective and efficiency.

The Chip Cooling Model and Route Optimization with Digital Microfluidics