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System-In-Package (SIP) microsystems, contain several interfaces formed between stacked, multiple, thin layers, manufactured using different materials and processes. Interface delamination is often recognized as a critical failure mechanism concerning the reliability of these products due to the high stresses at the interfaces. Accurate measurement of interface fracture toughness/ critical energy release rate (CERR) in these miniature interface systems over full range of mode mixities is an ongoing challenge. In addition, modeling of these interfaces requires good understanding of the underlying delamination mechanism which is far more difficult with existing macroscopic experimental setups. In this research, a new miniature mixed mode bending (MMMB) setup for in-situ characterization of interface delamination is designed [1]. The shematic design of the loading mechanism to achieve mixed mode bending (MMB) loads over full range of mode mixities is shown in Fig.1. The capability and functionality of the initial design (Fig. 2a) was proven from tests conducted on custom made glue interface samples [2]. Nevertheless, several modifications were performed to the initial design, in order to enhance its range of applicability: by increasing its limits of (i) maximum load, (ii) maximum displacement, and to improve its ease-of-use by increasing its (iii) robustness. Figure 2 shows the design of the improved MMMB setup (Fig. 2b) mounted in micro-tensile stage and eventually in scanning electron microscope (SEM) chamber (Fig. 2c). Important changes in the new design include (Fig. 2): (i) introduction of new hinges (1,2), (ii) replacement of the critical hinges with elliptical hinges to have more rotation (3), (iii) optimization of hinge geometry and increased robustness (4), (iv) all hinges are loaded in tension (5), and (v) increased length of the MLM (6).

An advanced experimental approach for detailed in-situ characterization of interface delamination