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High-resistivity polycrystalline silicon (HRPS) is presented as a novellow-cost and low-loss substrate for radio-frequency (RF) passivecomponents in wafer-level packaging and integrated passive networks.A record quality factor (Q¼11; 1 GHz; 34 nH) and very low loss(0.65 dB=cm; 17 GHz) are demonstrated for inductors and coplanarwaveguides, respectively, on HRPS.EC project Bluewhale (IST-2000-10036), and of the Portugese Foundation for Science and Technology (SFRH=BD=4717=2001, POCTI=ESE=38468=2001, FEDER)

High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging