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Surface functionalized BN particles with grafted hyperbranched polyarylamide (BN-HBP) were prepared and used to improve the thermal conductivity and low dielectric constant of BN-filled cyanate ester resin (BN-HBP/CE) composites. The thermal stability, dielectric properties, thermal conductivity and dynamic mechanical properties of the BN-HBP/CE composites were investigated. The results illustrate that BN-HBP/CE composites with a load of 32 wt% exhibit a high glass transition temperature of 283 °C, low dielectric constant of 3.29 at 1 MHz, and a desirable thermal conductivity of 0.97 W/(m·K). Additionally, these novel materials exhibit a high decomposition temperature of 5% weight loss at 407 °C and low curing shrinkage of -0.64%. When the loading is 38 wt%, the thermal conductivity of BN-HBP/CE composites is 1.27 W/(m·K). These findings have significant implications for the preparation of high-performance substrates that meet the requirements for application as printed circuit board substrates.

rsc advances

Cyanate ester composites containing surface functionalized BN particles with grafted hyperpolyarylamide exhibiting desirable thermal conductivities and a low dielectric constant