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The application of low-dimensional materials for heat dissipation requires acomprehensive understanding of the thermal transport at the cross interface,which widely exists in various composite materials and electronic devices. Inthis work, we proposed an analytical model, named as cross interface model(CIM), to accurately reveal the essential mechanism of the two-dimensionalthermal transport at the cross interface. The applicability of CIM is validatedthrough the comparison of the analytical results with molecular dynamicssimulations for a typical cross interface of two overlapped boron nitridenanoribbons. Besides, it is figured out that the factor ({\eta}) has importantinfluence on the thermal transport besides the thermal resistance inside andbetween the materials, which is found to be determined by two dimensionlessparameters from its expression. Our investigations deepen the understanding ofthe thermal transport at the cross interface and also facilitate to guide theapplications of low-dimensional materials in thermal management.

Cross interface model for the thermal transport across interface between overlapped boron nitride nanoribbons