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In this study, the effect of the thickness of a copper oxide-shell on flash light sintering of Cu nanoparticles (NPs) was investigated. The electrical properties of Cu nano-ink films with various oxide-shell thicknesses were examined by measuring the sheet resistance. Furthermore, the amount of PVP in the Cu NP-ink was varied to reduce the copper oxide-shell efficiently and enhance the flash light sintering of the Cu NPs. Also, to investigate the reduction and sintering phenomena of Cu NPs with respect to the copper oxide shell thickness, the sheet resistances of the Cu films were measured in real-time using an in situ resistance measuring system during the flash light sintering process. The results of this study established the maximum allowable thickness of the copper oxide shell that allows flash light sintering and also provided the optimal amount of PVP in Cu nano-ink for a particular copper oxide shell thickness.

Effect of copper oxide shell thickness on flash light sintering of copper nanoparticle ink