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A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degrees C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 x 10(-6) Omega m). This novel process may open a new strategy in the field of printed electronics

rsc advances

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu<sup>2+</sup>-alkanolamine metallacycle compounds for electrically conductive layer formation

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu²⁺-alkanolamine metallacycle compounds for electrically conductive layer formation