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A silane-based adhesion promoter suitable for a multi-dielectric-layer coating on a digital microfluidic chip is reported. It measures >100× improvement in chip lifetime via transforming the bonding of the dielectric layers (Ta2O5 and Parylene C) from nonspecific to chemical. The refined chip-fabrication protocol also allows low EWOD actuation voltages down to 5 V.

Adhesion promoter for a multi-dielectric-layer on a digital microfluidic chip