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High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu 0.5  HEA substrate was investigated. (Cu 0.76 , Ni 0.24 ) 6 Sn 5  intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu 0.5  HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu 0.5  substrate.

Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder