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Facile, effective and reliable etching technique for the formation of uniform silicon (Si) nanowire arrays were realized through the incorporation of back substrates with metal-assisted chemical etching (MaCE). In comparison with conventional MaCE process, a dramatic increase of etching rates upon MaCE process could be found by employing the conductive back substrates on p-type Si, while additionally prevented the creation of nanopores from catalytic etching reaction. Examinations on the involving etching kinetics, morphologies, wetting behaviors and surface structures were performed that validated the role of back substrates upon MaCE process. It was found that the involved two pathways for the extraction of electrons within Si favored the localized oxidation of Si at Si/Ag interfaces, thereby increasing the etching rate of MaCE process. This back-substrate involved MaCE could potentially meet the practical needs for the high-yield formation of Si nanowire arrays.

Enhancing formation rate of highly-oriented silicon nanowire arrays with the assistance of back substrates