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The spatially precise integration of arrays of micro-patternedtwo-dimensional (2D) crystals onto three-dimensionally structured Si/SiO$_2$substrates represents an attractive strategy towards the low-costsystem-on-chip integration of extended functions in silicon microelectronics.However, the reliable integration of the arrays of 2D materials on non-flatsurfaces has thus far proved extremely challenging due to their poor adhesionto underlying substrates as ruled by weak van der Waals interactions. Here wereport on a novel fabrication method based on nano-subsidence which enables theprecise and reliable integration of the micro-patterned 2D materials/siliconphotodiode arrays exhibiting high uniformity. Our devices display peaksensitivity as high as 0.35 A/W and external quantum efficiency (EQE) of ca.90%, outperforming most commercial photodiodes. The nano-subsidence techniqueopens a viable path to on-chip integrate 2D crystals onto silicon forbeyond-silicon microelectronics.

Nano-Subsidence Assisted Precise Integration of Patterned Two-Dimensional Materials for High-Performance Photodetector Arrays