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Deterministic positioning and assembly of colloidal nanoparticles (NPs) ontosubstrates is a core requirement and a promising alternative to top downlithography to create functional nanostructures and nanodevices with intriguingoptical, electrical, and catalytic features. Capillary-assisted particleassembly (CAPA) has emerged as an attractive technique to this end, as itallows controlled and selective assembly of a wide variety of NPs ontopredefined topographical templates using capillary forces. One critical issuewith CAPA, however, lies in its final printing step, where high printing yieldsare possible only with the use of an adhesive polymer film. To address thisproblem, we have developed a template dissolution interfacial patterning (TDIP)technique to assemble and print single colloidal AuNP arrays onto variousdielectric and conductive substrates in the absence of any adhesion layer, withprinting yields higher than 98%. The TDIP approach grants direct access to theinterface between the AuNP and the target surface, enabling the use ofcolloidal AuNPs as building blocks for practical applications. The versatileapplicability of TDIP is demonstrated by the creation of direct electricaljunctions for electro- and photoelectrochemistry and nanoparticle-on-mirrorgeometries for single particle molecular sensing.

Template Dissolution Interfacial Patterning of Single Colloids for Nanoelectrochemistry and Nanosensing