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Composite materials offer numerous advantages in a wide range of applications, including thermoelectrics. Here, semiconductor-metal composites are produced by just blending nanoparticles of a sulfide semiconductor obtained in aqueous solution and at room temperature with a metallic Cu powder. The obtained blend is annealed in a reducing atmosphere and afterward consolidated into dense polycrystalline pellets through spark plasma sintering (SPS). We observe that, during the annealing process, the presence of metallic copper activates a partial reduction of the PbS, resulting in the formation of PbS-Pb-Cu  x  S composites. The presence of metallic lead during the SPS process habilitates the liquid-phase sintering of the composite. Besides, by comparing the transport properties of PbS, the PbS-Pb-Cu  x  S composites, and PbS-Cu  x  S composites obtained by blending PbS and Cu  x  S nanoparticles, we demonstrate that the presence of metallic lead decisively contributes to a strong increase of the charge carrier concentration through spillover of charge carriers enabled by the low work function of lead. The increase in charge carrier concentration translates into much higher electrical conductivities and moderately lower Seebeck coefficients. These properties translate into power factors up to 2.1 mW m -1 K -2 at ambient temperature, well above those of PbS and PbS + Cu  x  S. Additionally, the presence of multiple phases in the final composite results in a notable decrease in the lattice thermal conductivity. Overall, the introduction of metallic copper in the initial blend results in a significant improvement of the thermoelectric performance of PbS, reaching a dimensionless thermoelectric figure of meri ZT = 1.1 at 750 K, which represents about a 400% increase over bare PbS. Besides, an average ZT  ave = 0.72 in the temperature range 320-773 K is demonstrated.

PbS–Pb–CuxS Composites for Thermoelectric Application

PbS–Pb–Cu_xS Composites for Thermoelectric Application