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A flow line function is proposed to describe the material deformation in ECAEfor a 120\degree die. This new analytical approach is incorporated into aviscoplastic self-consistent polycrystal code to simulate the texture evolutionin Route A of copper and compared to experimental textures as well as to thosecorresponding to simple shear.

Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die