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Because of SiC monocrystal belongs to difficult-to-process material, improving its processing quality and effect has great significance. This paper carries out a great deal of experimental research of compound processing with ultrasonic vibration on SiC monocrystal, and obtains important factors that influence processing result, i.e., based on relevant regularities of sawing force and processing parameters, processing parameter optimization model is established under the constraints of sawing force, wire saw life, and wire saw tensile stress. Solving the model by means of genetic algorithm, an optimum grouping of processing parameters is obtained. Research result indicates that this method could effectively obtain processing parameters under certain processing conditions, helps to enhance the processing efficiency of SiC monocrystal

Processing Parameters’ Multi-objective Optimization for Compound Machining with Ultrasonic Vibration on SiC Monocrystal