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Results on beam tests of 3D silicon pixel sensors aimed at the ATLASInsertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented.Measurements include charge collection, tracking efficiency and charge sharingbetween pixel cells, as a function of track incident angle, and were performedwith and without a 1.6 T magnetic field oriented as the ATLAS Inner Detectorsolenoid field. Sensors were bump bonded to the front-end chip currently usedin the ATLAS pixel detector. Full 3D sensors, with electrodes penetratingthrough the entire wafer thickness and active edge, and double-sided 3D sensorswith partially overlapping bias and read-out electrodes were tested and showedcomparable performance.

Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade