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The early stage of the reactive interdiffusion in the Cu-Al system wasinvestigated at 350 {\textdegree}C and 300 {\textdegree}C thanks to in-situtransmission electron microscopy. A special care was given to find conditionswhere the electron beam and the sample free surface do not affect significantlythe reaction. A special emphasis was then given on the influence of grainboundaries that are fast diffusion paths, and on nanoscaled particles that mayinteract with the transformation front. It was found that there is a transientstate followed by a steady state where the mean growth rates of intermetalliccompounds follow a parabolic law indicating that the kinetics is diffusioncontrolled. Thanks to the in-situ observations at the nanoscale, it was alsopossible to track the local velocity of interfaces between the differentphases. Strong fluctuations were exhibited within length scales smaller than100 nm and they are partly attributed to interface pinning by nanoscaledparticles. Last, considering thermodynamic and kinetic arguments, it is shownthat it is mainly an indirect effect induced by a local change of solute fluxesand of concentration gradients.

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy