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Recently, we demonstrated controllable 3D self-folding by means of capillaryforces of silicon-nitride micro-objects made of rigid plates connected to eachother by flexible hinges [1]. In this paper, we introduce platinum electrodesrunning from the substrate to the plates over these bendable hinges. Thefabrication yield is as high as (77 +/- 2) % for hinges with a length less than75 {\mu}m. The yield reduces to (18 +/- 2) % when the length increases above100 {\mu}m. Most of the failures in conductivity are due to degradation of theplatinum/chromium layer stack during the final plasma cleaning step. Thebi-layer hinges survive the capillary folding process, even for extremely smallbending radii of 5 {\mu}m, nor does the bending have any impact on theconductivity. Stress in the different layers deforms the hinges, which does notaffect the conductivity. Once assembled, the conductive hinges can withstand acurrent density of (1.6 +/- 0.4) $10^6$ A/cm$^2$ . This introduction ofconductive electrodes to elastocapillary self-folded silicon-basedmicro-objects extends the range of their possible applications by allowing anelectronic functionality of the folded parts.

Capillary origami of micro-machined micro-objects: Bi-layer conductive hinges