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We present measurements of the low temperature thermal conductivity formaterials useful in the construction of cryogenic supports for scientificinstrumentation and in the fabrication of flat flexible cryogenic cabling. Thematerials we measure have relatively low thermal conductivity. We present amethod for measuring the heat transfer coefficient of flat cabling and show,using an example, that the thermal conductivity of a flex cable is reasonablywell predicted by composing the thermal conductivities of its constituentmaterial layers. Room temperature physical and mechanical data is given for thematerials studied, as well as an overview of relevant materials science andmanufacturing details. Materials include Timet Ti 15-3 and Ti 21S, Materionalloy vit105 (LM105) in amorphous state, ATI Metals Nb-47Ti, Johnson Mattheynitinol (NiTi), Mersen graphite grade 2020, DuPont Pyralux coverlay and VespelSCP-5050, and Fralock Cirlex polyimide sheets. All data is in the temperaturerange 0.5 to 2 K, and up to 5 K for SCP-5050.

Properties of selected structural and flat flexible cabling materials for low temperature applications