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Titanium (Ti), due to its excellent properties, is widely exploited in thinfilm technology that usually leads to the production of {\alpha}-phase (hcp) Tifilms. In this work, we investigate the phase evolution of Ti films depositedby varying type and energy of the film-forming species. To investigatedifferent plasma species environments, films with different thicknesses aregrown by using conventional Direct Current Magnetron Sputtering (DCMS) and HighPower Impulse Magnetron Sputtering (HiPIMS). Furthermore, HiPIMS depositionswith different substrate bias voltage US (0 V, -300 V and -500 V) are performedto investigate different ion energy ranges. Microstructure, morphology andresidual stress of the deposited films, as well as the DCMS and HiPIMS plasmacomposition, are analysed with different characterization techniques. The DCMSsamples exhibit the Ti {\alpha}-phase only and show a tensile residual stressdecreasing with thickness. As far as HiPIMS samples are concerned, acompressive-tensile-compressive (CTC) behavior is observed for residualstresses as thickness increases. Specifically, films deposited in low energyion conditions (US =0 V) show the presence of the Ti fcc phase up to a maximumthickness of about 370 nm. Differently, films deposited under high energyconditions (US = -300 V and -500 V) show the nucleation of the Ti{\omega}-phase for thicknesses greater than 260 and 330 nm, respectively. Theformation of these unusual Ti phases is discussed considering the differentdeposition conditions.

Role of energetic ions in the growth of fcc and {\omega} crystalline phases in Ti films deposited by HiPIMS