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HighlightsAn up-bottom laser erasing process utilizing electrochemical corrosion has been integrated into the bottom-up writing process.    The presented erased laser writing technology exhibits excellent reproducibility for sustainable manufacturing of flexible highly conductive Cu structure.    The suitability of the writing-erasing-rewriting process for repairing failure patterns and reconfiguring circuits has been demonstrated.Supplementary Information  The online version contains supplementary material available at 10.1007/s40820-021-00714-3.

Laser Erasing and Rewriting of Flexible Copper Circuits