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This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell.The theoretical results show that acoustic streaming does not take place within the micro-via(either through or blind-via's),however it does help improve cupric ion transport in the area close to the mouth of a via.This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions.Experiments showing the improved quality of the filling of vias are also presented.

Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming