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The phase equilibrium in the Ag-Bi-Cu system was experimentally determined at 573 K, 773 K, and 973 K by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) on annealed alloys and liquid/solid couples. The experimental results indicate that the mutual solubility of the components is limited. Based on the present results and literature data, phase equilibria in the Ag-Bi-Cu system were thermodynamically assessed. Wetting of Bi-2.6Ag-xCu alloys on Cu substrates was studied with the sessile drop method in the presence of flux at 573 K and 623 K. It was found that the wetting to non-wetting transition corresponds to the solubility limit of Cu in liquid. Selected solidified solder–substrate couples were cross-sectioned and their interfacial microstructure examined with SEM–EDS. There are no reaction products at the interface, but the copper surface becomes rough because of dissolution by liquid solder.

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System