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A self-cooling device has been developed by combining a commercial n-channel power metal–oxide–semiconductor field-effect transistor (MOSFET) and single-crystalline Sb-doped n-type or B-doped p-type silicon wafers in order to improve the heat removal or cooling quantitatively. The electric current dependence of the temperature distribution in the self-cooling device and the voltage between the source and drain electrodes have been measured to estimate the Peltier heat flux. We found that the average temperature is decreased for a power MOSFET in which an electric current of 50 A flows. In particular, the average temperature of the power MOSFET was decreased by 2.7°C with the n-type Si wafer and by 3.5°C with the p-type Si wafer, although an electric current of 40 A makes little difference. This certainly warrants further work with improved measurement conditions. Nonetheless, the results strongly indicate that such n-type or p-type silicon wafers are candidate materials for use in self-cooling devices.

Electric Current Dependence of a Self-Cooling Device Consisting of Silicon Wafers Connected to a Power MOSFET