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This investigation has used flexural test to explore the effects of thermaltreatments, i.e., high-temperature and cryogenic environments on the mechanicalproperty of alumina particulate-reinforced Cu metal matrix micro andnanocomposites in ex-situ and in-situ conditions. Cu-5 vol. pct alumina micro(10 micron)- and nanocomposites (<50 nm) fabricated by powder metallurgy routewere subjected to up-thermal shock cycle [193 K to 353 K (-80C to 80C)] anddown-thermal shock cycle [193 K to 353 K (from 80C to -80C)] for different timeperiods followed by 3-point bend test. One batch of specimens (micro andnanocomposites) was conditioned at [193 K to 353 K (from 80C to -80C)]separately followed by 3-point flexural test. High-temperature flexural testwas performed at [373 K to 523 K (100C to 250C)] on the micro andnanocomposites. All the fractured samples obtained after various thermaltreatments were studied under scanning electron microscope (SEM). Thedevelopment of thermal stresses quite often results in concentration ofresidual stresses at the particle/matrix interface eventually weakening it.Enhancement of flexural strength was recorded for down- as well as forup-thermal shock in microcomposites. The high-temperature flexural strengths ofmicro and nanocomposites are lower than those at ambient temperature. Theamelioration and declination in mechanical properties as a consequence ofthermal shock, thermal conditioning, and high-temperature flexural testing havebeen discussed in the light of fractography.

Effect of thermal and cryogenic conditioning on flexural behavior of thermally shocked Cu-Al2O3 micro- and nano-composites