English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

In this article, the microstructure properties of a novel Pb-free solder composite were examined. A binary nickel-titanium shape memory alloy (SMA) fiber was used to reinforce the Sn-rich matrix, to take advantage of the superelastic properties of the fiber. The objective of this study was to understand long-term, high-temperature interfacial growth in a model NiTi fiber-reinforced Sn matrix composite solder system. The microstructure was quantified by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and wavelength dispersive spectroscopy (WDS). The mechanical properties of the interfacial zone, e.g., Young’s modulus and hardness, were characterized by nanoindentation. The evolution of the reaction products with time and the relationship between composition and local mechanical properties are discussed.

Interfacial Reactions in Model NiTi Shape Memory Alloy Fiber-Reinforced Sn Matrix “Smart” Composites