Open AccessGrowth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface
Author(s) -
Shengyan Shang,
Anil Kunwar,
Yanfeng Wang,
Lin Qu,
Haitao Ma,
Yunpeng Wang
Publication year - 2019
Publication title -
journal of materials science materials in electronics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.489
H-Index - 75
eISSN - 1573-482X
pISSN - 0957-4522
DOI - 10.1007/s10854-018-00564-7
Subject(s) - materials science , intermetallic , soldering , ostwald ripening , composite material , grain size , metallurgy , alloy , nanotechnology
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