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This work deals with the modelling and simulation of curing phenomena inadhesively bonded piezo metal composites which consist of an adhesive layerwith integrated piezoelectric module and two surrounding metal sheet layers. Ina first step, a general modelling framework is proposed which is able torepresent curing phenomena in polymers at finite strains. Based on thisformulation, a concretized model is deduced for the simulation of curing in onespecific epoxy based adhesive. Here, appropriate material functions arespecified and the thermodynamic consistency is proved. Regarding the finiteelement implementation, a numerical integration scheme and a new approach forthe consideration of different initial conditions are provided. Finally, finiteelement simulations of a newly proposed manufacturing process for theproduction of bonded piezo metal composite structures are conducted. A deepdrawing process of the composite with uncured adhesive layer and the subsequentadhesive curing are investigated.

Modelling and simulation of adhesive curing processes in bonded piezo metal composites