English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Tools annual

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Presents the access of premium content as premium feature

Premium Content

Global: Zendy Plus annual

Global: Zendy Free Plan

The paper deals with microchannel cooling where water is the cooling liquid. ANSYS software and CFDRC-ACE one were used to analyse the flows and the origin of large amount of heat that can be overtaken from the chip when microchannels are applied. The concept of microscale heat transfer coefficient is discussed. The phenomena taking place in microchannel flows are simulated and some conclusions are introduced to explain the results met in many references but still unexplained. In contrast to existing, standard methods, the new approach describes the local phenomena and is used in the further investigation of the cooling microstructure. An effect of its geometry on the total overtaken heat flux is analysed with respect to optimal conditions as well as to technological restrictions.

The Numerical Approach to Analysis of Microchannel Cooling Systems